Methods, systems, and apparatus for constructing customized display panels

ABSTRACT

The disclosed embodiments generally relate to a method, system and apparatus for forming a custom-sized display panel. An exemplary method to form a custom display from a large sheet of pixels includes: providing a sheet of pixels having a TFT substrate, a liquid crystal layer and a second substrate, the sheet of pixels having a first perimeter, the liquid crystal medium interposed between the TFT substrate and the second substrate; forming a display panel from the sheet of pixels, the display panel having a display panel perimeter, the second display having a first edge defined by the TFT substrate extending beyond the second substrate to thereby expose an electrical trace on the TFT substrate; sealing the liquid crystal layer on the first edge; conductively exposing the electrical trace on the TFT substrate; and forming a column driver line on the TFT substrate to communicate a driver signal to the second display.

RELATED APPLICATION DATA

The present application is a continuation of co-pending application Ser.No. 16/995,511, filed Aug. 17, 2020, and issuing as U.S. Pat. No.11,231,631, which is a continuation of U.S. application Ser. No.16/265,836, filed Feb. 1, 2019, now U.S. Pat. No. 10,747,078, whichclaims benefit of U.S. provisional application Ser. No. 62/624,998,filed Feb. 1, 2018, the entire disclosures of which are expresslyincorporated by reference herein.

FIELD OF THE INVENTION

The disclosure generally relates to electronic displays. The disclosurerelates to method, system and apparatus for constructing a customizeddisplay from a region excised from a sheet with pre-fabricated pixels.

BACKGROUND

The conventional methods for creating a custom-sized liquid-crystaldisplay (LCD) begins with designing a specific mechanical layoutincluding the number and layout of pixels in the active area as asingle, indivisible, display unit. For example, a forty-six-inchdiagonal display panel having an array of 3,840 pixels horizontally and2,160 pixels vertically might be used as the display device in aforty-six-inch color television. The pixels are most often constructedof subpixels, ordinarily a red, a green and a blue colored subpixel,taken together to form a full-color pixel in order to control theperception of color from each pixel by the human visual system.

Each controllable subpixel is located at the intersection of twoconductive signal lines, ordinarily referred to as a row and a columnline. For example, an array of 3,840 pixels horizontally and 2,160pixels vertically might be addressed by 11,520 column lines (one foreach of the three subpixels comprising a pixel) and 2,160 row lines. Insome sub-pixel designs, including In-plane Switching-mode (IPS-mode). InIPS-mode LCDs, a reference voltage, ordinarily called the common voltageor Vcom is provided via conductive traces running parallel to the row orcolumn lines for example. In other cases, the reference voltage isprovided on the opposing substrate and in some cases, reference voltagesare provided on both the opposing substrate and on conductive tracesrunning parallel to the row and-or column lines.

To control the individual subpixels, electrical signals are created anddelivered over the conductive row and column lines. The source of theseelectrical signals are electronic circuits, called line drivers, thatare ordinarily located along edges of the pixel array to minimize thedistance the driver is from the row and column lines while remaining outof the active area of the display. Column lines are driven by circuitsordinarily called column drivers that are located along one or both ofthe horizontal edges of the array. Likewise, row lines are driven byelectronic circuits called row drivers located along one or bothvertical edges. The row and column drivers are attachedelectro-mechanically to the row and column lines at specificallydesigned sites along the edge of the array. These sites accommodateattachment of either one of two means to drive the row or column lines.

A first conventional technique is to attach a custom flexible substrateordinarily having a single integrated circuit (IC) attached. Thisassembly of an IC on a flexible (flex) substrate with patterned wires iscalled a Tape Carrier Package (TCP). The TCP is conventionally appliedin an automated process called Tape Automated Bonding or TAB. The TCP iselectro-mechanically attached to the row and columns lines atspecifically designated sites along the edge of the array.

A second conventional technique is to attach a driving IC directly tothe site of the rows and column lines along the edge of the array. Thisarrangement is called Chip on Glass (COG). It is also a conventionalalternative to integrate the driver function directly into the peripheryof the active area making use of patterned transistor processing duringthe fabrication of the display.

FIG. 1 illustrates a conventional custom display with integratedattachment sites. Specifically, FIG. 1 shows display panel 102 havingpixel layout 104. Display panel 102 includes TFT substrate 106, externalconnection contact leads 108, column line fan in 110, COG row driver 110(with a COG IC die mounting) and row line fan in 114. The display panel102 may also include attached circuit boards (not shown).

In pixel array 102, together with the row and column line driverattachment sites, or the integrated drivers, or partially integrateddrivers or some combination of these form the essential design of theLCD panel as a unit. This unit, created by patterns in layers ofmaterials, is specifically designed to enable the creation of a displayhaving a particular size and a particular pixel format ordinarilyexpressed as the number pixels wide by the number of pixel high. Tomanufacture such unit, the design is repeated a number of times on amother glass, a standardized host substrate for a repeated design unitthat is processed by the LCD fabricating process in a standardized way.If another horizontal by vertical size display is desired for example,another design must be made, tooled and then manufactured.

FIG. 2 illustrates a conventional standardized mother glass which hostsseveral copies of the same custom display design to improve productionefficiency. Mother glass 200 serves as the means to design the factoryequipment around a standard-sized substrate (mother glass) forefficiency reasons. In FIG. 2, mother glass 200 includes portions 202,204, 206, 208, 210 and 212. An exemplary mother glass may include a TFTsubstrate (not shown) and a color filter substrate (not shown). A liquidcrystal (LC) medium (not shown) may be interposed between the TFTsubstrate (not shown) and the color filter substrate (not shown).

Each piece of production equipment is designed to handle the motherglass 200 irrespective of the particular design being made. Therefore, asingle design (e.g., 202, 204, 206, 208, 210 and 212) is repeated asmany times as needed to fill up the mother glass to minimize the unusedspace and thereby make as many displays with the same steps aspractical. The use of the mother glass to make many copies of the samedesign further emphasizes the conventional method for making a display:a dedicated, comprehensive design which includes the creation of theelectrical connection sites as part of each display.

Other pixel array technologies exist as well. OLEDs for example, sharemany common elements with LCDs including, in particular, a similar rowand column addressing scheme of the subpixels. OLEDs differ from LCDs inthat other reference voltage functions, such as power and ground(modulated or not) and in some instances, dimming control signals arealso required. OLEDs differ most fundamentally from LCDs in that OLEDsare a self-luminous technology. The array is ordinarily opaque andtherefore electronics can be hidden behind the array. LCDs by contrast,are ordinarily operated as pixel-modulated, optical transmission devicesmaking images by locally modulating the transmission of light throughthem. This light ordinarily originates from a back-light unit behind(the non-viewing side) of the display. Thus, in this ordinary case, itis not possible to place electronics behind the LCD as they would blocklight from the back-light and not be hidden from view.

SUMMARY

In certain embodiments, the disclosure provides method, system andapparatus to form custom-sized displays from pre-made sheets ofuncommitted pixels, sheets of pixels. In certain embodiments, the termsuncommitted pixel refers to general-purpose pixels not part of aspecific design. Alternatively, pixels can be harvested from dedicateddisplays, but re-purposed for a new display size. While the disclosedembodiments reference liquid crystal displays, it should be noted thatthe disclosed principles are not limited thereto and may be appliedequally to forming custom-sized displays from other pixel-based displaypanels.

In one exemplary implementation, a region of pixels is separated from alarger region or a sheet of pixels, which serves as a stock source forforming custom-sized displays. Edges of this excised region are preparedfor electrical signal contact attachment sites to enable electricalconnection between the driver and the appropriate row and/or columnconductors. In one embodiment, an electro-mechanical connection isconstructed at the periphery of the excised pixel region, to the row,column, common electrodes or other electrodes necessary to operate thepixels. The newly-formed connection can provide stimulation of thecontrol lines to operate the excised region as they would have beenprior to excision. The ability to properly control an excised region ofpixels to allow creation of an image by those excised pixels through theconnection of control signals after excising, enables the constructionof many differently-sized displays from a thereby, general-purpose,sheet of pixels.

While the disclosed embodiments are illustrated in relation to LCDdevices, the disclosed principles are not limited thereto and may beapplied to other display technologies. By way of example, extractedpixels of an OLED device can be enabled using a similar approach asdisclosed herein; that is, by providing the appropriate stimulus inputsneeded to operate the array through attachment of electronics toexisting signal lines. The signal lines may be found, for example, atthe array periphery.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other embodiments of the disclosure will be discussed withreference to the following exemplary and non-limiting illustrations, inwhich like elements are numbered similarly, and where:

FIG. 1 schematically illustrates a conventional custom display withintegrated attachment sites;

FIG. 2 illustrates a conventional standardized mother glass which hostsseveral copies of the same custom display design to improve productionefficiency;

FIG. 3 illustrates a cross-section of a prepared edge representative ofan embodiment of the disclosure;

FIG. 4 is a schematic illustration of elements of this invention where asheet of pixels is sub-divided into smaller regions;

FIG. 5A is a microscope image showing a portion of pixel traceline afterthe color filter layer is removed;

FIG. 5B is a microscope image showing the pixel tracelines of FIG. 5Aafter plasma etching exposes the tracelines;

FIG. 6 is a microscope image showing optimal removal locations oftracelines to prevent shorting;

FIG. 7 is a microscope illustration showing wire-bond connection betweenthe edge of the TFT substrate and a driver circuit flex according to oneembodiment of the disclosure;

FIG. 8 schematically shows a cut glass edge cross section according toone embodiment of the disclosure;

FIG. 9 schematically illustrates a custom display panel formed from alarger sheet of pixels according to one embodiment of the disclosure;

FIG. 10 schematically illustrates custom flex lines according to oneembodiment of the disclosure;

FIG. 11 schematically illustrates the column driver circuit board of inFIG. 9;

FIG. 12 is a microscope image showing a diagonally-cut pixel regionaccording to one embodiment of the disclosure;

FIG. 13 illustrates conductive metal pads patterned over traces in thepixel array along the diagonal cut of a display;

FIG. 14 shows further isolation patterning of the ink pad through, forexample, laser ablation according to one embodiment of the disclosure;

FIG. 15 illustrates a so-called stair stepped flex with conductivetraces patterned on the rear side of the flex substrate according to oneembodiment of the disclosure;

FIG. 16 shows the stair stepped flex with conductive traces of FIG. 15bonded to the diagonally cut and patterned diagonal cut of display ofFIG. 14; and

FIG. 17 is a flow diagram for forming a custom-sized display accordingto one embodiment of the disclosure.

DETAILED DESCRIPTION

There are applications for custom-sized LCDs that require smallproduction volumes. It is impractical to serve this demand with aconventional, custom-designed LCD. By its nature, a custom-sized LCD isonly reasonably available and affordable if large numbers of identicalcopies are produced. The mass production provides economies of scalewhich break even when amortized over a large production. Conventionalmethods fail to produce economical small or custom-sized displays insmall quantities.

In one embodiment, the disclosure provides a method to construct acustom-sized display by extracting a region of pixels from a largerregion, properly sealing the edges and preparing at least one part ofthe extracted region to accept attachment of electronic circuitry neededto operate the extracted (and now isolated) pixels or sub-pixels.Conventional display pixel arrays include signal lines for addressingrow and column, as well as other control lines such as a commonelectrode. The signal lines are repeated for each unit. The repeatingunit is often a subpixel but may consist of several subpixels or pixels.Regardless of the specific implementation, the ordinary intent of anarray of pixels is that every group of pixels be capable of renderingidentically to a like group of other pixels in the array so that aportion of an image looks consistent regardless of where that portion islocated on the display.

To provide custom-sized display panels from a mother glass panel, anembodiment of the disclosure may include the steps of cutting the motherglass to a desired size while providing access to pixel trace lines ofthe TFT substrate, exposing the pixel trace lines, preventing lateralshorting in the trace lines as needed and wire-bonding a drivercircuitry to the exposed trace lines.

FIG. 3 illustrates a cross-section of a prepared edge representative ofan embodiment of the disclosure. Specifically, FIG. 3 shows pixel sheet300 which includes TFT substrate 302, color filter substrate 304 and LCmaterial 306. TFT substrate 302 may comprise one or more trace lines(not shown) connecting one or more pixels (not shown) thereon. TFTsubstrate may comprise conventional material used for forming anelectronic display panel. Color filter layer 304 may also compriseconventional material (e.g., transparent material). Color filtersubstrate may provide different transparencies and optical filtration todelineate Red-Green-Blue (RGB) colors. Liquid crystal (LC) material 306may comprise conventional LC medium used in LC displays.

As discussed in reference to FIG. 2, a large display panel or even anentire mother glass comprised only of pixels, a sheet of pixels, may becut according to the disclosed embodiments to smaller, custom-sizeddisplays. In FIG. 3, a sheet of pixels is cut such that TFT substrate302 extends beyond color filter substrate 304 by length d, 308. Length dmay be configured such that tracelines connecting pixels (or at leastone pixel) to row lines and column lines are accessible as shown byarrow 310. In an exemplary application, the length d may be about 0.5-3mm. In another embodiment, the length d may be about 1-2 mm. In stillanother embodiment, length d may be about 1.5 mm. As stated, in oneembodiment, the color filter substrate 304 is cut shorter than the TFTsubstrate 302 to allow access to the pixel array control-signal busses.A flexible (flex) substrate (not shown) with patterned conductors ismated to conductive signal traces on the TFT substrate to effectivelyextend the control wires on the display. The wire extensions on the flexwhich can then be routed as needed to circuitry needed to operate thedisplay.

To seal the edge of the now-cut display, liquid crystal sealing material312 can be used to at least prevent leakage of LC material from the openedge, but also to maintain the spacing between the two substrates,prevent contamination of the remaining LC material, as well asmaintaining the mechanical integrity of the assembly. Exemplary sealingmaterial may include UV curable adhesives such as LOCTITE AA 3492.

A feature resulting from this embodiment is that any extracted region ofpixels from a larger region of pixels behaves the same as any otherregion of the larger region when presented the same control stimulus. Itis therefore possible to make many same- or differently-sized customdisplays from a single sheet of pixels provided a proper signaling isprovided to the array control lines to control each pixel.

FIG. 4 is a schematic illustration of elements of this invention where asheet of pixels is sub-divided (singulated) into smaller regions. Eachregion is then enabled as a display through preparing the edges toaccept attachment to electrical conductors which provide pixel addressand control lines. In FIG. 4, pixel sheet 400 is subdivided into severalexcised regions 402. Excised region 404 is a mock-up of a singlesubdivided display panel. As illustrated, excised region 404 includes aLC seal 406 along the perimeters to prevent LC leakage other benefits.Next, column- and row-line flex-print attachment area is prepared forconnection to respective drivers. This is shown as arrows 408 and 410for column-line and row-line flex, respectively.

In an exemplary embodiment, the column and row lines which have beenmade accessible after cutting a larger panel (see FIG. 1) are exposed(made conductive) by removing the passivation layer, if needed. Thepassivation layer may be, for example, silicon dioxide (SiO2).

FIGS. 5A and 5B show a representative subpixel together with a portionof pixel traces after cutting a sheet of pixels (FIG. 5A) and afterplasma etch to render conductive (exposed) control line traces. In FIG.5A, the color filter layer is removed and the TFT substrate is exposed.FIG. 5A shows column lines 502, row lines 504 and common voltage line506. Each group of column line and row line control a group of pixels.Upon removal of the color filter layer (FIG. 4), each of the tracelinesmay be accessible.

However, the tracelines may be covered by a passivation layer therebymaking them not electrically accessible. In one embodiment of thedisclosure, the tracelines are made conductively accessible by removingthe passivation (or dielectric) layer from the tracelines. This is shownin FIG. 5B, where plasma etch is used to remove the passivation layer toleave exposed traces 510 intact. The exposed tracelines may now beaccessed by a new driver circuitry. That is, the uninsulated tracelinescan now be electrically contacted by any of a number of suitableohmic-contact means, including for example, wire bonding, to therebyprovide a conductive path to apply the required control signals fromexternal sources to drive the row lines, column lines and any othercontrol lines to direct the pixels of the newly formed, now displaypanel element, the display region. On one embodiment of the disclosure,plasma etch is used to remove the passivation layer covering thetracelines. A plasma etch process, for example, can etch away theovercoat while having a negligible impact on the underlying metal leadswhich form the address and control lines. Other physical and/or chemicalprocesses may be used without departing from the disclosed embodiments.

Once the tracelines are conductively exposed, a laser or other means canbe used to remove material from between parallel address and controllines to prevent an unintended conduction path (i.e., shorting) betweenthe parallel traces on the TFT substrate. Shorting could occur if, forexample, in the case of wire bonding, the weld of the wire contactpoints are wide enough to contact both horizontal and vertical goingtraces simultaneously. This removal step may be optionally performedbefore or after the insulation layer removal step and may be eliminatedif lateral conduction between parallel lines is not an issue. In anexemplary embodiment, laser ablation may be used to strategically removea portion of the conduction path to prevent shorting.

FIG. 6 is a microscope image showing optimal removal locations oftracelines to prevent shorting. In FIG. 6, horizontal and verticaltracelines are shown on a portion of TFT substrate 600. Locations 610show exemplary location for laser ablation. Removal of a portion of thetracelines at locations 610 can prevent signal shorting.

FIG. 7 is a microscopic illustration showing, by way of example,wire-bond connection between the row-edge of the TFT substrate and adriver circuit flexible printed-wire substrate according to oneembodiment of the disclosure. Specifically, portion 702 shows an edge ofa TFT substrate of a region of pixels exposing row and common electrodeedges, a row-side edge. Portion 704 illustrates an edge region of aprinted-wire substrate, for example, with conductive traces 724 matchingthe pitch of the signal line traces being connected. In this row andcommon voltage connection example, wires 722 make a wire bond contact toboth row and common voltage traces of the TFT substrate and thecorresponding trace 724 of the substrate 704. Traces 724 lead away fromthe edge of the TFT substrate to the line driving circuit (not shown)and thereby there is a conductive path from each individual line driversignal source to each individual row and common voltage trace of theTFT. The exposed tracelines define the column and row lines as well asthe common voltage line in this example display. In this row and commonvoltage connection example, the row and common electrodes are connectedto corresponding traces on substrate 704 and column lines are notconnected. It will be understood that in another example, column lines,along a column-edge might be connected to traces on a substrate in likefashion, where row and common line traces of the TFT substrate are notconnected. In yet a third example, in which a TFT cut edge issubstantially along a diagonal, at least locally, where row traces,common voltage traces and column lines intersect the TFT edge,connection to all three types of traces might be made in light fashionbetween drive signal sources and corresponding TFT control signaltraces. In FIG. 7, the vertical lines define conductive column lines.Laser ablation is used, in this example of contacting row and Vcomlines, to remove conductivity (shorting) through the column lines.Portions 710, 712, 714, 716, 718 and 720 define portions removed bylaser ablation to prevent shorting. Several wire-bonds 722 connectpertinent tracelines 724 of substrate 704. Each wirebond wire 722connects one of the TFT tracelines to a respective electrical trace ofthe driver circuit signal traces 724 of substrate 704.

FIG. 8 schematically shows a cut glass edge cross section according toone embodiment of the disclosure. In FIG. 8, pixel sheet 802 has beencut according to the disclosed principles. Substrate 802 includes colorfilter substrate 806 and TFT substrate 804. A liquid crystal 805 mediumis disbursed between substrates 804 and 806. Liquid crystal is sealed asschematically shown at location 808. Tracelines (not shown) of the TFTsubstrate are connected to driver bus 814 through wirebond 812. Thelocation of wirebond 812 is then optionally sealed as shown byencapsulant 816, as required, for example LOCTITE AA 3492® (from HenkelAdhesives Technologist), a silicon-based RTV adhesive or other suitablemeans. In FIG. 8, the cut portion of the display can be minimized toprovide a minimal bezel area 810 and thereby a maximum active area outof the total area of the display unit surface facing the viewer.

FIG. 9 schematically illustrates a custom display panel formed from alarger sheet of uncommitted pixels, or pixels harvested from a largerdisplay panel according to one embodiment of the disclosure. In FIG. 9,display region 910 is formed from a larger sheet of pixels. Displayregion 910 comprises a standard pixel pitch as was formed in theoriginating pixel sheet. A horizontal edge and a vertical edge ofdisplay region 910 are cut according to the disclosed principles, suchthat the TFT substrate extends beyond the color filter (or other)substrates. After exposing the tracelines of the TFT substrate, customcolumn driver flex 914 and custom row driver flex 916 are attached tothe exposed tracelines on the open horizontal (column-edge) and vertical(row-edge) sides. In this exemplary embodiment of the invention, thecolumn driver flex 914 connects the column tracelines to column driverintegrated circuit 950 mounted on the flex 914 and the column driver 950to the column driver printed circuit board 920. Flex 914 may alsoconnect other control signals, such as the common voltage for example,to the circuit board 920. Likewise, the row driver flex 916 connects therow tracelines to row driver integrated circuit 952 and the row driverto the printed circuit board 918. Flex 916 may also connect othercontrol signals such as the common voltage for example, to the circuitboard 918. Row driver circuitry board 918 and column driver circuitryboard 920 communicate through connection bus 940.

Column driver circuitry may include video interface integrated circuit922 to receive for example, HDMI signal 930. Video interface circuitry922 demultiplexes the incoming signal, which may be an HDMI signal orother video signal stream. The demultiplexed signal is then communicatedto optional scalar circuitry 924. Optional scalar circuitry 924 may bedesigned to control the size of the image rendered by the display region910 by receiving the incoming video signal image and making it larger orsmaller as needed to assure the rendered image occupies the intendedarea of the display region 910. Timing controller (TCON) 926 providesand synchronizes the row and column signal timing.

One consequence of making differently-sized displays from a same pixelarray is that the number of pixels per unit area will remain the samebut the area will change. If for example, a custom-display designerwants to make a conventional 1024 horizontal×768 vertical pixel array tohave a 10.4-inch diagonal image size, the designer would layout thedisplay to have those exact parameters. However, in one application ofthe disclosure, the size of the display can be made suitably close to10.4-inch diagonal, but may have 2000 horizontal.times.1500 verticalpixels for example. An image source which is captured natively as1024×768 pixels will not fill up the whole image area. If an electronicimage scaler is provided upstream of the 2000×1500 display, the 1024×768image can be enlarged or scaled to 2000×1500 pixels and thereby occupythe whole active area of the custom-sized display.

In the display made according to an embodiment of the disclosure, theimage may be rendered with more pixels than the conventionally-designed,custom-sized display can render. This higher resolution rendering of theoriginal 1024.times.768 native format image, for example, is onlysubtlety different from as it would appear on theconventionally-designed, custom-sized display and for most applicationintents and purposes is equivalent. Thus, a part of the design to allowa standardized pixel array stock to be used to construct a custom-sizeddisplay is the use of a scaler to emulate the image pixel count formatof the custom-sized display region 910.

A scaler is a conventional electronic circuit that is used to convertone image pixel format to another. An image is ordinarily rectangularand describable as x pixels wide and y pixels high. A rectangulardisplay that is xx pixels wide and yy pixels high will only be to renderthe x by y image while using the whole of the display and whiledisplaying all the image when x=xx and y=yy. However, the two pixelformats are not the same in general. The image can have both pixels thanthe display. There are standardized formats for both images anddisplays. In this case, the pixel format (xx by yy) of the constructedcustom-sized display made from the extracted region of pixels is known.A scaler can be employed to accept one or multiple standard inputformats (e.g., 1024×768, 1920×1080, 3840×2160, etc.) so that theresulting custom-sized display system can be thereby designed to renderany particular input format on the constructed, custom-sized displayhaving a fixed pitch of pixels that may or may not correspond to theincoming image. This feature separates display pixel pitch from displaysize. As a custom-sized display of the present disclosure is constructedfrom a sheet of pixels having a fixed pitch, the scaler function assuresthat a standard video input format for example can be rendered on thecustom-sized display at full size (i.e., where the rendered image isneither cropped nor rendered in only a portion of the display area).FIG. 6 shows representative flow diagram of electronic circuit blocksused to receive video signals of an image control the extracted pixelregion to render the image.

FIG. 11 schematically illustrates the column driver circuit board 920 ofin FIG. 9. Specifically, FIG. 11 provides an exemplary functional blockdiagram of electronic circuit blocks used to receive video signals andprovide an image control to the extracted pixel region of the display.Each representative box in FIG. 11 may comprise hardware, software,firmware or a combination of hardware, software and firmware. Eachrepresentative functional block may include one or more processorcircuitries in communication with one or more memory circuitries toprovide the desired function.

In FIG. 11, column driver circuitry 1100 receives video source signal1102. The video source signal may be a generic video signal withoutconsideration of the display size. Video source signal may comprise, forexample, LVDS (FPD-Link), eDP, V-by-One, HDMI, VGA, DVI and the like.Signal receiver 1104 receives and optionally demultiplexes the incomingsignal. Signal receiver 1104 may optionally demodulate the incomingsignal. The received signal is then directed to scalar circuitry 1106.Scalar circuitry 1106 may be optionally used to scale the incomingsignal to the proper size for the new display panel having displayregion 910.

Timing controller 1108 communicates with both the custom attached columndriver 1114 and custom attached row driver 1112 to provide proper signaltiming for each display pixel. The custom attached column and rowdrivers may be similar to the flex drivers described in relation to FIG.10. The column and row drivers then communicate the image signal todisplay 1110, which may be a custom-sized display according to thedisclosed principles.

In another embodiment, the disclosure relates to connecting to bothaddress and control lines to displays cut along a diagonal edge relativeto the pixel array's row and column organization. Cutting displays alonga diagonal enables making virtually any shape as shapes can beapproximated with piecewise straight segments along the periphery oralternatively, the TFT edge may be cut along a continuously curvingpath, to accomplish any shape. In other words, a regular or irregularshape, including for example round, can be approximated by a mix ofhorizontal, diagonal and vertical segments of varying length. Thus, incertain disclosed embodiments, the edge of a display sheet may be cutdiagonally or along a curve. In this manner, pixels are, at leastlocally, approximately diagonally cut at the TFT substrate. FIG. 12 is amicroscope image showing a diagonally-cut pixel region according to oneembodiment of the disclosure.

FIG. 13 illustrates conductive pads patterned over traces in the pixelarray along the diagonal cut of a display. Display 1302 of FIG. 13includes tracelines (row lines, column lines and common voltage line)that control each pixel. In addition, conductive pads 1304 are patternedover traces in the pixel array along the diagonal cut. The addition ofconductive material (pad) over the exposed traces increases the surfacearea of the leads. Such addition may be optional. In one embodiment,conductive pads may be deposited either in a proper pattern or broadlyand then post patterned using a laser ablation or other means forisolating the control signal leads.

FIG. 14 shows further isolation patterning of the pad through, forexample, laser ablation according to one embodiment of the disclosure.The additional patterning creates fine features of conductive pads whichmay be registered to trace the pattern of the TFT substrate. In FIG. 14,the diagonally cut display is custom-designed to have a diagonalgeometric shape. It includes main display 1402 with a side-cut portion1405. At the side-cut portion 1405, conductive pads 1404 are arrangedalong the side-cut 1405. The conductive pads 1404 can be coupled to aflex pad as will be discussed further below. In one application, aprecision laser can be used to ablate away material including materialbelow the ink pad. An ACF (not shown) can be placed as a strip coveringall the ink pads.

FIG. 15 shows the conductive traces patterned on the rear side of theflex substrate (not shown) according to one embodiment of thedisclosure. The stair stepped flex can be used with diagonal cuts asshown at FIGS. 12-14. In FIG. 15, conductive traces 1510 can be used tocouple a driver circuitry (not shown) to the pads on the TFT substrateside-cut or the diagonal edge.

FIG. 16 shows the stair stepped flex with conductive traces of FIG. 15bonded to the diagonally cut and patterned diagonal cut of display ofFIG. 14. As shown in FIG. 16, the flex and prepared TFT substratealigned and attached to each other through the ACF (not shown)sandwiched between the two substrates. Note that the five electrodes ofeach large pad are connected to a separate wire on the flex. In FIG. 16,display 1602 is formed with a diagonal side-cut 1605. The traces 1610are connected (e.g., wire-bonded) to respective patterned pads 1604 toprovide signal communication between a driver (not shown) and display1602.

FIG. 17 is a flow diagram for forming a custom-sized display accordingto one embodiment of the disclosure. The process of FIG. 17 starts withproviding a mother glass or a large-scale glass display. The glassdisplay may include conventional substrates and printed circuitry (e.g.,TFT circuitry on a substrate) to receive an image signal and display animage. At step 1704, the mother glass is cut to one or more smallersizes (i.e., singulated). The smaller display regions, formed to becomean element of a display panel may be of substantially the same sizes ormay have different shapes and sizes, depending on the desiredapplication. At step 1706, the liquid crystal layer is sealed to preventleakage of the liquid crystal and provide other benefits previouslymentioned.

At step 1708, the cut edge(s) are prepared. In one application, thetracelines of the TFT substrate may be etched (chemically, physically,both or otherwise) to expose the tracelines and thereby render themconductive. For example, chemical etching or ion plasma treatment may beused to expose the traces. In another embodiment, laser ablation orother methods can be used to prevent possible shorting between proximaltracelines.

At step 1710, row and column drivers are attached to the panel display'sedges. In an exemplary embodiment, custom driver contact points are usedto connect a diagonal edge of a display region through flex lines to adriver. At step 1712, a printed circuit board (PCB) or other integratedcircuitry (IC) having the driver and optionally other video processingcircuitry is connected to the custom-sized display through the flexlines. At step 1714, one or more polarizers may be optionally attachedto the exposed tracelines. In one application, the polarizers may beoptical sheets that go over the display region and part of the opticallight-valve function of an LCD. The polarizers may be optionally addedbefore, after or in the middle of the process.

While both the use of wire bonding and ACF attachment technology aredisclosed as a means to connect one conductor to another, it will beunderstood that such an electrical connection can be made by a number ofmeans without departing from the present invention.

Displays may be custom sized in as much as a design is commissioned tocreate an image region having a particular area and a particular pixelpitch. A custom display of the instant disclosure is capable of beingany size and has several advantages over the conventional approach inwhich an OEM makes a display with the electronic drive circuitryattachment points are embedded in the pixel design from the onset. Oneadvantage of the present disclosure is reduced construction costs.Commissioning a custom-sized display from an OEM is a massiveundertaking requiring a large investment of design engineering time tolayout the custom display for production and a large investment in themasks and other custom tools needed to produce the design. Design housesand OEMs charge large sums to cover these costs and also require a largeminimum order size. In the instant disclosure, pre-made pixels are usedand so none of these costs are incurred for the commissioning of thecustom display. Furthermore, the lead time between when the customdesign is commissioned and when the first article is available is mostoften 6 months to a year. In this disclosure, these lead times can besignificantly reduced because the design is made from stock, pre-madepixels and so none of the design and factory tooling time is incurred.Further still, OEMs require a large minimum order size to both amortizemuch of the costs for the design across many units and thereby make anindividual display less costly as well as justify the lost-opportunitycosts where the same resources could have been devoted to a moreprofitable display. In the instant disclosure, because the displays aremade from pre-made pixels, the large costs of the OEMS and design housesare avoided. Furthermore, because the disclosure avoids all these costs,it is possible to offer much smaller minimum order quantities.

Because of all of these and other advantages there are many applicationswhich can benefit from a custom display made by the disclosure. Theseapplications include, for example: industrial equipment, medicalequipment, aircraft displays, automotive displays, home appliances andpublic information displays among other examples. Furthermore, becauseof these advantages new applications can be enabled, applications whichwould otherwise not have adequate volume to justify the minimum orderquantity requirements for example. As the display application field isexpanding this disclosure provides enablement to support that expansion.

The disclosed principles may be implemented with automated systems,including artificial intelligence and/or automated systems. In oneexample, a processor circuitry may be programmed with instructionsstored in a memory circuitry, which when executed by the processorcircuitry causes one or more devices to implement the steps recited inany of the disclosed embodiments. In another embodiment, the disclosedprinciples may be stored at a non-transitory medium and implemented byone or more processor circuitries to provide a custom display accordingto the disclosed principles. In still another embodiment, the disclosedembodiments may be implemented in software, hardware or a combination ofsoftware and hardware (e.g., firmware) and cause one or more devise toimplement the disclosed principles to thereby form a display panel froma sheet of pixels.

The following examples are provided to further illustrate additionalnon-limiting and exemplary embodiments and/or applications according tothe disclosed principles.

Example 1 is directed to a method to form a custom display from a sheetof pixels, the method comprising: providing a sheet of pixels having aTFT substrate, a liquid crystal layer and a second substrate, the sheetof pixels having a first perimeter, the liquid crystal medium interposedbetween the TFT substrate and the second substrate; forming a displaypanel from the sheet of pixels, the display panel having a display panelperimeter, the second display having a first edge defined by the TFTsubstrate extending beyond the second substrate to thereby expose anelectrical trace on the TFT substrate; sealing the liquid crystal layeron the first edge; conductively exposing the electrical trace on the TFTsubstrate; and forming a column driver line on the TFT substrate tocommunicate a driver signal to the second display.

Example 2 is directed to the method of example 1, further comprisingconnecting the column driver line on the TFT substrate to an externaldriver.

Example 3 is directed to the method of any preceding example, whereinconnecting the column driver line on the TFT substrate further includeswire-bonding a driver line to the at least one etched electrical trace.

Example 4 is directed to the method of any preceding example, whereinthe external driver further comprises a scalar to convert an incomingimage signal for the display panel to a second image signal configuredto properly scale an image to be displayed on the display panel.

Example 5 is directed to the method of any preceding example, whereinconductively exposing the electrical trace further comprises exposingthe electrical trace by substantially removing a passivation layer.

Example 6 is directed to the method of any preceding example, whereinconductively exposing the electrical trace further comprises removingSiO2 from the electrical trace.

Example 7 is directed to the method of any preceding example, whereinthe TFT substrate extends beyond the second substrate by about 0.5 to 3mm.

Example 8 is directed to the method of any preceding example, whereinforming a column driver line on the TFT substrate further comprise laserablating to define a conductive path on the TFT substrate.

Example 9 is directed to the method of any preceding example, furthercomprising connecting the conductive path with an external column driverand wherein the column driver is configured to scale a first imagesignal configured for the display panel to a second image signalconfigured to be displayed on the display panel.

Example 10 is directed to the method of any preceding example, whereinthe display panel comprises a first edge positioned at an angle withrespect to at least one other edge of the display panel.

Example 11 is directed to the method of any preceding example, whereinthe second substrate is a color filter substrate.

Example 12 is directed to the method of any preceding example, whereinthe second perimeter is smaller than the first perimeter.

Example 13 is directed to a method to convert a pixel of a first displaypanel to a driver-contact point, the method comprising: uncovering afirst pixel of a plurality of pixels on a surface of a display panel,the pixel having a plurality of tracelines including a row traceline anda column traceline to engage the first pixel; electrically exposing therow traceline and the column traceline of the first pixel to therebyform an exposed row traceline and an exposed column traceline;connecting a row driver line to the exposed row traceline; andconnecting a column driver line to the exposed column traceline.

Example 14 is directed to the method of example 13, wherein uncovering afirst pixel on a surface of a display panel further comprises removingone or more display panel layers to uncover a plurality of electricaltracelines on a substrate surface of the display panel.

Example 15 is directed to the method of examples 13-14, whereinelectrically exposing the row traceline further comprises etching therow traceline to remove an insulating layer.

Example 16 is directed to the method of examples 13-15, whereinelectrically exposing the row traceline further comprises physicallyremoving an insulating layer covering the row traceline.

Example 17 is directed to the method of examples 13-16, furthercomprising substantially isolating the column traceline from a firstadjacent column traceline.

Example 18 is directed to the method of examples 13-17, whereinsubstantially isolating the column traceline further comprises formingan opening to isolate the column traceline from the first adjacentcolumn traceline.

Example 19 is directed to the method of examples 13-18, wherein thecolumn driver line comprises communicates with a flex driver line.

Example 20 is directed to the method of examples 13-19, whereinuncovering a first pixel further comprises cutting a display panel froma sheet of pixels to form the display panel, the display panel having aperimeter.

Example 21 is directed to the method of examples 13-120, wherein atleast one side of the display panel is at an acute angle with respect toat last one other side of the display panel.

Example 22 is directed to the method of examples 13-21, wherein thedisplay panel defines a backlit display panel.

Example 23 is directed to the method of examples 13-22, wherein thedisplay parameter is smaller than a perimeter of the sheet of pixels.

Example 24 relates to the method of any preceding example, wherein thedisplay panel defines a backlit display panel.

Example 25 relates to a display panel prepared according to the methoddescribed in any of the preceding examples.

Example 26 relates to a processor circuitry in communication with amemory circuitry, the memory circuitry comprising instructions, whichwhen executed by the processor circuitry causes one or more devices,including processors, to implement the steps recited in any of thepreceding examples.

While the principles of the disclosure have been illustrated in relationto the exemplary embodiments shown herein, the principles of thedisclosure are not limited thereto and include any modification,variation or permutation thereof.

1. A method to form a custom display from a sheet of pixels, the methodcomprising: providing a sheet of pixels having a first substrate, aliquid crystal layer and a second substrate, the sheet of pixels havinga first perimeter, and the liquid crystal medium interposed between thefirst substrate and the second substrate; forming a display panel from aportion of the sheet of pixels, the display panel having a display panelperimeter, the display panel perimeter including a first edge defined bythe first substrate extending beyond the second substrate to therebyexpose an electrical trace on the first substrate; sealing the liquidcrystal layer along the first edge; conductively exposing the electricaltrace on the first substrate; and forming a driver line on the firstsubstrate to communicate a driver signal to the display panel.
 2. Themethod of claim 1, further comprising connecting the driver line on thefirst substrate to an external driver.
 3. The method of claim 2, whereinconnecting the column driver line on the first substrate furtherincludes wire-bonding a driver line to the exposed electrical trace. 4.The method of claim 1, wherein the external driver further comprises ascaler configured to convert an incoming image signal for the displaypanel to a second image signal configured to properly scale an image tobe displayed on the display panel.
 5. The method of claim 1, whereinconductively exposing the electrical trace further comprises exposingthe electrical trace by substantially removing a passivation layer. 6.The method of claim 1, wherein conductively exposing the electricaltrace further comprises removing SiO2 from the electrical trace.
 7. Themethod of claim 1, wherein the first substrate extends beyond the secondsubstrate by about 0.5 to 3 mm.
 8. The method of claim 1, whereinforming a driver line on the first substrate further comprise laserablating to define a conductive path on the first substrate.
 9. Themethod of claim 8, further comprising connecting the conductive pathwith an external column driver and wherein the column driver isconfigured to scale a first image signal for the display panel to asecond image signal configured to properly scale an image to bedisplayed on the display panel.
 10. The method of claim 1, wherein thedisplay panel comprises a first edge positioned at an angle with respectto at least one other edge of the display panel.
 11. The method of claim1, wherein the second substrate is a color filter substrate.
 12. Themethod of claim 1, wherein the second perimeter is smaller than thefirst perimeter.
 13. A method to form a custom display from a sheet ofpixels, the method comprising: providing a sheet of pixels having afirst perimeter, a TFT substrate, a liquid crystal medium and a secondsubstrate, the liquid crystal medium interposed between the TFTsubstrate and the second substrate; forming a display panel from thesheet of pixels, the display panel having a display panel perimeter, thedisplay panel perimeter having a first edge defined by the TFT substrateextending beyond the second substrate to thereby expose electricaltraces on the TFT substrate along target row and column edges; sealingthe liquid crystal layer on the first edge; conductively exposing theexposed electrical traces on the TFT substrate; and connecting a columndrive line on the TFT substrate to an external driver to communicate adriver signal to the display panel, wherein providing the sheet ofpixels comprises extracting a region of pixels from a larger motherglass panel of pixels.
 14. The method of claim 13, further comprisingelectrically contacting the conductively exposed electrical traces byany of a number of suitable ohmic-contact means, including for example,wire bonding, to thereby provide a conductive path to apply the requiredcontrol signals from external sources to drive the row lines, columnlines and any other control lines to direct the pixels of the newlyformed, now display panel element, the display region.
 15. The method ofclaim 13, further comprising preventing lateral shorting in the tracelines as needed and wire-bonding driver circuitry to the exposedelectrical traces.
 16. A method to convert a pixel of a first displaypanel to a driver-contact point, the method comprising: uncovering afirst pixel of a plurality of pixels on a surface of a display panel,the pixel having a plurality of tracelines including a row traceline anda column traceline to engage the first pixel; electrically exposing therow traceline and the column traceline of the first pixel to therebyform an exposed row traceline and an exposed column traceline;connecting a row driver line to the exposed row traceline; andconnecting a column driver line to the exposed column traceline.
 17. Themethod of claim 16, wherein uncovering a first pixel on a surface of adisplay panel further comprises removing one or more display panellayers to uncover a plurality of electrical tracelines on a substratesurface of the display panel.
 18. The method of claim 16, whereinelectrically exposing the row traceline further comprises etching therow traceline to remove an insulating layer.
 19. The method of claim 16,wherein electrically exposing the row traceline further comprisesphysically removing an insulating layer covering the row traceline. 20.The method of claim 16, further comprising substantially isolating thecolumn traceline from a first adjacent column traceline.